sfh 487 p gaaias-ir-lumineszenzdiode (880 nm) gaaias infrared emitter (880 nm) lead (pb) free produc t - rohs compliant 2007-04-02 1 wesentliche merkmale ? gaalas-led mit sehr hohem wirkungsgrad ? hohe zuverl?ssigkeit ? hohe impulsbelastbarkeit ? gute spektrale anpassung an si-fotoempf?nger ? geh?usegleich mit sfh 309 anwendungen ? ir-fernsteuerung von fernseh-, rundfunk- und videoger?ten, lichtdimmern ? lichtschranken bis 500 khz ? mnzz?hler ? sensorik ? diskrete optokoppler typ type bestellnummer ordering code geh?use package sfh 487 p Q62703Q0517 3-mm-led-geh?use, plan, klares violettes epoxy-gie harz, anschlsse im 2.54-mm-raster ( 1 / 10 ??), anodenkenn - zeichnung: krzerer anschlu 3 mm led package (t 1), plane, violet-colored transparent epoxy resin, solder tabs lead spacing 2.54 mm ( 1 / 10 ??), an - ode marking: short lead features ? very highly efficient gaalas-led ? high reliability ? high pulse handling capability ? good spectral match to silicon photodetectors ? same package as sfh 309 applications ? ir remote control for hifi and tv sets, video tape recorder, dimmers ? light-reflection switches (max. 500 khz) ? coin counters ? sensor technology ? discrete optocouplers
2007-04-02 2 sfh 487 p grenzwerte ( t a = 25 c) maximum ratings bezeichnung parameter symbol symbol wert value einheit unit betriebs- und lagertemperatur operating and storage temperature range t op ; t stg ? 40 ? + 100 c sperrspannung reverse voltage v r 5 v durchla strom forward current i f 100 ma sto strom, 10 s surge current i fsm 2.5 a verlustleistung power dissipation p tot 200 mw w?rmewiderstand, freie beinchenl?nge max. 10 mm thermal resistance, lead length between package bottom and pc-board max. 10 mm r thja 375 k/w kennwerte ( t a = 25 c) characteristics bezeichnung parameter symbol symbol wert value einheit unit wellenl?nge der strahlung wavelength at peak emission i f = 100 ma peak 880 nm spektrale bandbreite bei 50% von i max , i f = 100 ma spectral bandwidth at 50% of i max ? 80 nm abstrahlwinkel half angle ? 65 grad deg. aktive chipfl?che active chip area a 0.09 mm 2 abmessungen der aktiven chipfl?che dimension of the active chip area l b l w 0.3 0.3 mm2 abstand chipoberfl?che bis geh?usevorderseite distance chip front to case surface h 0.4 ? 0.8 mm
sfh 487 p 2007-04-02 3 schaltzeiten, i e von 10% auf 90% und von 90% auf 10%, bei i f = 100 ma, r l = 50 switching times, i e from 10% to 90% and from 90% to 10%, i f = 100 ma, r l = 50 t r , t f 0.6/0.5 s kapazit?t capacitance v r = 0 v, f = 1 mhz c o 15 pf durchla spannung forward voltage i f = 100 ma, t p = 20 ms i f = 1 a, t p = 100 s v f 1.5 (< 1.8) 3.0 (< 3.8) v sperrstrom reverse current v r = 5 v i r 0.01 ( 1) a gesamtstrahlungsflu total radiant flux i f = 100 ma, t p = 20 ms e 25 mw temperaturkoeffizient von i e bzw. e , i f = 100 ma temperature coefficient or i e or e , i f = 100 ma tc i ? 0.5 %/k temperaturkoeffizient von v f , i f = 100 ma temperature coefficient of v f , i f = 100 ma tc v ? 2 mv/k temperaturkoeffizient von peak , i f = 100 ma temperature coefficient of peak , i f = 100 ma tc 0.25 nm/k kennwerte ( t a = 25 c) characteristics (cont?d) bezeichnung parameter symbol symbol wert value einheit unit
2007-04-02 4 sfh 487 p strahlst?rke i e in achsrichtung gemessen bei einem raumwinkel = 0.01 sr radiant intensity i e in axial direction at a solid angle of = 0.01 sr bezeichnung parameter symbol wert value einheit unit strahlst?rke radiant intensity i f = 100 ma, t p = 20 ms i e > 2 mw/sr strahlst?rke radiant intensity i f = 1 a, t p = 100 s i e typ. 30 mw/sr
sfh 487 p 2007-04-02 5 relative spectral emission rel = f ( ) forward current, i f = f ( v f ) single pulse, t p = 20 s radiation characteristics rel = f ( ? ) 0 750 rel ohr00877 800 850 900 950 nm 1000 20 40 60 80 % 100 10 ohr00881 f v -3 -2 10 -1 10 0 10 1 10 0123456v8 a f ohr01894 020 40 60 80 100 120 0.4 0.6 0.8 1.0 100 90 80 70 60 50 0 10 20 30 40 0 0.2 0.4 0.6 0.8 1.0 ? radiant intensity single pulse, t p = 20 s permissible pulse handling capability i f = f ( ), t a = 25 c, duty cycle d = parameter i e e 100 ma = f ( i f ) 10 ohr00878 e f -3 -2 10 -1 10 0 10 1 10 2 10 0 10 10 1 10 2 10 4 ma e (100ma) 3 10 10 f ohr00886 1 2 10 3 10 4 10 ma -5 10 s = d f t dc 0.005 = d p t t t p p t 0.5 0.2 0.1 0.01 0.02 0.05 10 -4 10 -3 10 -2 10 -1 10 0 10 1 10 2 max. permissible forward current i f = f ( t a ) forward current vs. lead length between the package bottom and the pc-board i f = f ( i ), t a = 25 c t ohr00880 0 f 0 20 40 60 80 100 ?c ma 25 50 75 100 125 ohr00949 f 0 0 5 10 15 20 25 mm 30 20 40 60 80 100 ma 120
2007-04-02 6 sfh 487 p ma?zeichnung package outlines ma?e in mm / dimensions in mm. empfohlenes l?tpaddesign wellenl?ten (ttw) recommended solder pad ttw soldering ma?e in mm (inch) / dimensions in mm (inch). 1.8 1.2 29 27 4.5 4.0 3.5 2.0 1.7 3.1 2.5 2.54 mm spacing ?3.1 ?2.9 0.8 0.4 0.6 0.4 4.0 3.6 0.6 0.4 chip position area not flat gex06308 0.7 0.4 cathode 4 (0.157) ohlpy985 4.8 (0.189)
sfh 487 p 2007-04-02 7 l?tbedingungen soldering conditions wellenl?ten (ttw) (nach cecc 00802) ttw soldering (acc. to cecc 00802) published by osram opto semico nductors gmbh wernerwerkstrasse 2, d-93049 regensburg www.osram-os.com ? all rights reserved. the information describes the type of component and shall not be considered as assured characteristics. terms of delivery and rights to change design reserv ed. due to technical requirements components may contain dangerous substances. for information on the types in question please contact our sales organization. packing please use the recycling operators known to you. we can also help you ? get in touch with your nearest sales office. by agreement we will take packing material back, if it is sorted. you must bear the costs of tr ansport. for packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. components used in life-support devices or system s must be expressly authorized for such purpose! critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of osram os. 1 a critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support de vice or system, or to affect its safety or effectiveness of that device or system. 2 life support devices or systems are intended (a) to be impl anted in the human body, or (b) to support and/or maintain and sustain human life. if they fail, it is reasonable to assume that the health of the user may be endangered. ohly0598 0 0 50 100 150 200 250 50 100 150 200 250 300 t t c s 235 c 10 s c ... 260 1. welle 1. wave 2. welle 2. wave 5 k/s 2 k/s ca 200 k/s cc ... 130 100 2 k/s zwangskhlung forced cooling normalkurve standard curve grenzkurven limit curves
mouser electronics related product links 720-sfh487p - osram opto semiconductor sfh 487 p
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